High Thermal Conductive Sheet HEATEX™

• HEATEX™ has an extremely high thermal conductivity in the thickness direction and contributes to the low thermal resistance of various electronic devices.
• Lineup of insulation series and high thermal conductive series (conductive filler type).
• HEATEX™ has a wide range of thickness lineup and high thermal conductivity.
• A rubber type soft sheet TIM without stickiness*.

(*) TIM: Thermal Interface Material

MORE INFORMATION
HEATEX™ has vertically oriented thermally conductive fillers with high thermal conductivity.
Above mentioned filler, which contains boron nitride has been used in the insulation series, and carbon-based material has been used in the high thermal conductive series. It can be used as an interface（TIM） to efficiently transfer the heat from heat-generating parts (CPU, LED backlight, power chip) to cooling parts (heat sink, so on..）

Electron micrograph of cross-sectional structure of high thermal conductivity sheet with carbon fiber vertically oriented

Image of using HEATEX

 
Easy to handle
Because of using silicone rubber, it is hard to break even when bent, has a silky feel, and has excellent workability.
Rework is also possible. Adhesive treatment of the sheet surface is available as an option.

 
Stable
Maintains low thermal resistance in pressurized environments.
Even if it is used for a long time in a harsh environment of 200°C, there is almost no change in physical properties. In addition, not as thermal grease, no pump-out phenomenon occurs.
* Pump out phenomenon
Materials that come into contact with grease undergo a pump-out phenomenon in which grease is discharged by repeating expansion and contraction as the temperature rises and falls. When the pump-out phenomenon occurs, the contact thermal resistance increases due to the generation of voids, and the initial performance cannot be obtained.