High Thermal Conductive Sheet HEATEX™
HEATEX™ has vertically oriented thermally conductive fillers with high thermal conductivity.
APPLICATION
Heat dissipation of heat-generating components of electronic/electric devices.
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Silver Nanoparticle Bonding Material Paste – FlowMetal™ for Die Attach
A silver paste for die-attach bonding which can be bonded at low temperatures by applying the technology of low-temperature sintering type silver nanoparticle ink.
APPLICATION
Dies bonding, dies touch applications
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Silver Nanoparticle Conductive Ink FlowMetal™
FlowMetal™ achieved the trade-off of long-term dispersion stability and low-temperature sinterability at a practical level.
APPLICATION
Base material – to be applied to plastic substrates with low heat resistance (ABS, PC, PET, etc.).
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TOPX™
Precision polishing using advanced dispersion processing technology.
APPLICATION
Polishing of optical communication connectors and LCD display components.
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Bando Squeegees
Satisfying various needs in screen printing.
APPLICATION
Print circuit boards, ceramic condensers, flat panel displays, compact disks, touch panel screen printing.
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Elastic Strain Sensor C-STRETCH™
Bando combined elastomer compound design, dispersion and film processing technologies to create a completely new type of sensor, in which the sensor itself stretches to detect the amount of elongation.
APPLICATION
- Movement measurement
- Biological information measurement
- Interface
